Staff and Governance
The day-to-day running of IMEMS is the responsibility of the Core Executive Committee, comprising the Director and Associate Directors and the Administrator.
Publication details for Prof Brian TannerTanner, B.K., Vijayaraghavan, R.K., Roarty, B., Danilewsky, A.N. & McNally, P.J. (2019). In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices. Microelectronics Reliability 99: 232-238.
- Publication type: Journal Article
- ISSN/ISBN: 0026-2714
- DOI: 10.1016/j.microrel.2019.06.006
- Further publication details on publisher web site
- Durham Research Online (DRO) - may include full text
Author(s) from Durham
The application of X-ray Diffraction Imaging to measure in operando thermal strains at individually powered components within fully packaged LM3046 silicon devices is described. It is shown that as the local strains increase with power dissipated, above a threshold power loading, the associated region of enhanced X-ray intensity increases monotonically. The changes in contrast in the image are discussed. Asterism in section topographs changes sign as the slit is moved across the component, consistent with lattice strain around the device due to the thermal expansion. Above a threshold power, this asterism increases linearly with power loading. By simultaneous measurement of the package surface temperature it is possible to deduce the local component temperature from the extent of the contrast in the X-ray image.
Full Executive Committee
Our Full Executive Committee is made up of the Core Executive Committee, listed above, plus a number of executive members including:
International Advisory Board
We are extremely fortunate to have be able to call on the help and guidance of colleagues from around the world who help to shape and guide our direction, strategy and international reach. Our current Advisory Board members are: