Staff and Governance
The day-to-day running of IMEMS is the responsibility of the Core Executive Committee, comprising the Director and Associate Directors and the Administrator.
Publication details for Prof Brian TannerTanner, B. K., Danilewsky, A. N., Vijayaraghavan, R. K., Cowley, A. & McNally, P. J. (2017). Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages. Journal of Applied Crystallography 50(2): 547-554.
- Publication type: Journal Article
- ISSN/ISBN: 0021-8898 (print), 1600-5767 (electronic)
- DOI: 10.1107/S1600576717003132
- Further publication details on publisher web site
- Durham Research Online (DRO) - may include full text
Author(s) from Durham
Transmission X-ray diffraction imaging in both monochromatic and white beam section mode has been used to measure quantitatively the displacement and warpage stress in encapsulated silicon devices. The displacement dependence with position on the die was found to agree well with that predicted from a simple model of warpage stress. For uQFN microcontrollers, glued only at the corners, the measured misorientation contours are consistent with those predicted using finite element analysis. The absolute displacement, measured along a line through the die centre, was comparable to that reported independently by high-resolution X-ray diffraction and optical interferometry of similar samples. It is demonstrated that the precision is greater than the spread of values found in randomly selected batches of commercial devices, making the techniques viable for industrial inspection purposes.
Full Executive Committee
Our Full Executive Committee is made up of the Core Executive Committee, listed above, plus a number of executive members including:
International Advisory Board
We are extremely fortunate to have be able to call on the help and guidance of colleagues from around the world who help to shape and guide our direction, strategy and international reach. Our current Advisory Board members are: