Staff and Governance
The day-to-day running of IMEMS is the responsibility of the Core Executive Committee, comprising the Director and Associate Directors and the Administrator.
Publication details for Prof Brian TannerBose, A.K., Vijayaraghavan, R.K., Cowley, A., Cherman, V., Tanner, B.K., Danilewsky, A.N., De Wolf, I. & McNally, P.J. (2016). Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages. IEEE Transactions on Components, Packaging and Manufacturing Technology 6(4): 653-662.
- Publication type: Journal Article
- ISSN/ISBN: 2156-3950 (print), 2156-3985 (electronic)
- DOI: 10.1109/TCPMT.2016.2527060
- Further publication details on publisher web site
Author(s) from Durham
We describe an X-ray diffraction imaging technique for nondestructive, in situ measurement of die warpage in encapsulated chip packages at acquisition speeds approaching real time. The results were validated on a series of samples with known inbuilt convex die warpage, and the measurement of wafer bow was compared with the results obtained by optical profilometry. We use the technique to demonstrate the impact of elevated temperature on a commercially sourced micro quad flat nonlead chip package and show that the strain becomes locked in at a temperature between 94 °C and 120 °C. Using synchrotron radiation at the Diamond Light Source, warpage maps for the entire 2.2 mm × 2.4 mm × 150-μm Si die were acquired in 50 s, and individual line scans in times as short as 500 ms.
Full Executive Committee
Our Full Executive Committee is made up of the Core Executive Committee, listed above, plus a number of executive members including:
International Advisory Board
We are extremely fortunate to have be able to call on the help and guidance of colleagues from around the world who help to shape and guide our direction, strategy and international reach. Our current Advisory Board members are: