Carbon Nanotube Integrations
The performance, reliability and lifetime of microelectromechanical systems devices and power electronic devices are dependent on the thermal management efficiency and the use of low resistivity interconnects. Carbon nanotubes (CNTs) are also potentially the best known thermal conductors and can potentially achieve ultra low resistivity. As such, they are ideal candidates for efficient thermal management and high performance interconnects. Their integration into IC technology for the development of a new class of devices is a key enabler. We are currently focusing on “low resistivity CNT interconnects” and “CNT interfacial thermal management” for application in RF MEMS and electronic power devices.
For further information contact: Dagou Zeze